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Toshiba Memory America, Inc. TH58BYG2S3HBAI4

4G SLC NAND BGA 24NM

Manufacturer
Toshiba Memory America, Inc.
Datasheet
Price
6.5
Stock
210

Product Details

Operating Temperature
-40°C ~ 85°C (TA)
Series
-
Supplier Device Package
63-BGA (9x11)
Packaging
Tray
Write Cycle Time - Word, Page
25ns
Technology
FLASH - NAND (SLC)
Memory Size
4Gb (512M x 8)
Memory Type
Non-Volatile
Part Status
Active
Memory Format
FLASH
Mounting Type
Surface Mount
Package / Case
63-BGA
Memory Interface
Parallel
Voltage - Supply
1.7V ~ 1.95V