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Samtec, Inc. ESQT-107-02-F-T-625
CONN SOCKET 21POS 0.079 GOLD PCB
- Manufacturer
- Samtec, Inc.
- Datasheet
- Price
- 4.11
- Stock
- 0
Product Details
- Applications
- -
- Ingress Protection
- -
- Contact Finish Thickness - Post
- -
- Contact Type
- Forked
- Insulation Material
- Liquid Crystal Polymer (LCP)
- Contact Finish Thickness - Mating
- 3.00µin (0.076µm)
- Contact Shape
- Square
- Number of Positions
- 21
- Mounting Type
- Through Hole
- Row Spacing - Mating
- 0.079" (2.00mm)
- Connector Type
- Elevated Socket
- Contact Finish - Post
- Tin
- Fastening Type
- Push-Pull
- Contact Length - Post
- 0.051" (1.30mm)
- Style
- Board to Board or Cable
- Number of Rows
- 3
- Current Rating (Amps)
- 4.5A per Contact
- Series
- ESQT
- Pitch - Mating
- 0.079" (2.00mm)
- Operating Temperature
- -55°C ~ 125°C
- Features
- -
- Voltage Rating
- -
- Mated Stacking Heights
- -
- Packaging
- Bulk
- Contact Material
- Phosphor Bronze
- Contact Finish - Mating
- Gold
- Part Status
- Active
- Insulation Color
- Black
- Number of Positions Loaded
- All
- Termination
- Solder
- Insulation Height
- 0.799" (20.30mm)
- Material Flammability Rating
- UL94 V-0