Images are for reference only. See Product Specifications for product details

Samtec, Inc. ESQ-108-12-T-S

CONN SOCKET 8POS 0.1 TIN PCB

Manufacturer
Samtec, Inc.
Datasheet
Price
1.3
Stock
0

Product Details

Connector Type
Elevated Socket
Contact Finish - Post
Gold
Fastening Type
Push-Pull
Contact Length - Post
0.265" (6.73mm)
Style
Board to Board
Number of Rows
2
Current Rating (Amps)
-
Series
ESD
Pitch - Mating
-
Operating Temperature
-55°C ~ 125°C
Features
-
Voltage Rating
-
Mated Stacking Heights
-
Packaging
Bulk
Contact Material
Beryllium Copper
Contact Finish - Mating
Gold
Part Status
Active
Insulation Color
Black
Number of Positions Loaded
All
Termination
Solder
Insulation Height
0.400" (10.16mm)
Material Flammability Rating
UL94 V-0
Applications
-
Ingress Protection
-
Contact Finish Thickness - Post
10.0µin (0.25µm)
Contact Type
Female Socket
Insulation Material
Liquid Crystal Polymer (LCP)
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Shape
Circular
Number of Positions
2
Mounting Type
Through Hole
Row Spacing - Mating
0.100" (2.54mm)