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Samsung Semiconductor, Inc. SPHWHAHDNG2VYZVVD2

HIGH POWER LED SERIES CHIP ON BO

Manufacturer
Samsung Semiconductor, Inc.
Datasheet
Price
4.12
Stock
0

Product Details

Height
1.37mm
Size / Dimension
18.50mm L x 15.00mm W
Series
CXM-11
Temperature - Test
85°C
CCT (K)
2700K 2-Step MacAdam Ellipse
CRI (Color Rendering Index)
80
Features
-
Light Emitting Surface (LES)
10.80mm Dia
Lens Type
Flat
Lumens/Watt @ Current - Test
109 lm/W
Packaging
Tray
Voltage - Forward (Vf) (Typ)
35V
Wavelength
-
Flux @ Current/Temperature - Test
1225lm (Typ)
Part Status
Active
Configuration
Rectangle
Current - Max
640mA
Type
Chip On Board (COB)
Viewing Angle
120°
Color
White, Warm
Current - Test
320mA