Renesas Electronics America HD64F3687GHV

Product Details

Packaging

Tray

Program Memory Type

FLASH

EEPROM Size

-

Operating Temperature

-40°C ~ 85°C (TA)

Part Status

Active

Supplier Device Package

96-FBGA (6x6)

Peripherals

DMA, LVD, POR, PWM, WDT

Voltage - Supply (Vcc/Vdd)

1.65V ~ 3.6V

Connectivity

CSIO, EBI/EMI, I²C, SPI, UART/USART

Mounting Type

Surface Mount

Number of I/O

66

Core Processor

ARM® Cortex®-M3

Speed

40MHz

Package / Case

96-LFBGA

Series

FM3 MB9A150RB

Data Converters

A/D 17x12b

RAM Size

64K x 8

Oscillator Type

Internal

Core Size

32-Bit

Program Memory Size

544KB (544K x 8)