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Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39871B4377P810
CSSP3 CU
- Manufacturer
- Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
- Datasheet
- Price
- 0
- Stock
- 5708
Product Details
- Insertion Loss
- 2.9dB
- Package / Case
- 6-SMD, No Lead
- Size / Dimension
- 0.118" L x 0.118" W (3.00mm x 3.00mm)
- Frequency - Center
- 925MHz
- Series
- -
- Ratings
- -
- Bandwidth
- 6MHz
- Packaging
- Digi-Reel®
- Part Status
- Active
- Applications
- Meter Reading
- Height (Max)
- 0.055" (1.40mm)
- Mounting Type
- Surface Mount