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Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39242B9634P810
BAW CSSP3 CU
- Manufacturer
- Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
- Datasheet
- Price
- 0
- Stock
- 4779
Product Details
- Bandwidth
- 96MHz
- Packaging
- Bulk
- Part Status
- Last Time Buy
- Applications
- Set-Top Boxes
- Height (Max)
- 0.043" (1.10mm)
- Mounting Type
- Surface Mount
- Insertion Loss
- 7.4dB
- Package / Case
- 8-SMD, No Lead
- Size / Dimension
- 0.118" L x 0.118" W (3.00mm x 3.00mm)
- Frequency - Center
- 1.25GHz
- Series
- -
- Ratings
- -