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Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39162B4353P810
CSSP3 CU AE
- Manufacturer
- Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
- Datasheet
- Price
- 0
- Stock
- 1828
Product Details
- Packaging
- Digi-Reel®
- Part Status
- Active
- Applications
- GPS
- Height (Max)
- 0.016" (0.40mm)
- Mounting Type
- Surface Mount
- Insertion Loss
- 0.8dB
- Package / Case
- 5-SMD, No Lead
- Size / Dimension
- 0.055" L x 0.043" W (1.40mm x 1.10mm)
- Frequency - Center
- 1.582GHz
- Series
- B4348
- Ratings
- AEC-Q200
- Bandwidth
- 46.8MHz