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Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39162B4348P810
CSSP3 CU AE
- Manufacturer
- Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
- Datasheet
- Price
- 0
- Stock
- 1658
Product Details
- Packaging
- Digi-Reel®
- Part Status
- Obsolete
- Applications
- Cellular, GSM
- Height (Max)
- 0.059" (1.50mm)
- Mounting Type
- Surface Mount
- Insertion Loss
- 6dB
- Package / Case
- 8-SMD, No Lead
- Size / Dimension
- 0.197" L x 0.197" W (5.00mm x 5.00mm)
- Frequency - Center
- 400MHz
- Series
- -
- Ratings
- -
- Bandwidth
- -