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NXP USA Inc. SC68376BGVAB25R

IC MCU 32BIT ROMLESS 160QFP

Manufacturer
NXP USA Inc.
Datasheet
Price
0
Stock
0

Product Details

Packaging
Tray
Program Memory Size
-
EEPROM Size
-
Program Memory Type
ROMless
Part Status
Obsolete
Operating Temperature
-40°C ~ 85°C (TA)
Peripherals
DMA, I²S, LCD, PWM, WDT
Supplier Device Package
208-TFBGA (12x12)
Connectivity
EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd)
1.1V ~ 3.6V
Mounting Type
Surface Mount
Number of I/O
10
Core Processor
ARM9®
Speed
180MHz
Package / Case
208-TFBGA
Series
LPC3100
Data Converters
A/D 3x10b
RAM Size
192K x 8
Oscillator Type
External
Core Size
16/32-Bit
Base Part Number
LPC315*