NXP USA Inc. S9S08SG8E2MTGR

Product Details

Packaging

Tray

Program Memory Size

8KB (8K x 8)

EEPROM Size

-

Program Memory Type

FLASH

Part Status

Active

Operating Temperature

-40°C ~ 85°C (TA)

Peripherals

Brown-out Detect/Reset, POR, WDT

Supplier Device Package

32-HVQFN (7x7)

Connectivity

I²C, SPI, UART/USART

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Mounting Type

Surface Mount

Number of I/O

28

Core Processor

ARM® Cortex®-M0

Speed

50MHz

Package / Case

32-VQFN Exposed Pad

Series

LPC1100L

Data Converters

A/D 8x10b

RAM Size

4K x 8

Oscillator Type

Internal

Core Size

32-Bit

Base Part Number

LPC1111