NXP USA Inc. S9S08SG4E2CTJR

Product Details

Core Size

32-Bit

Base Part Number

LPC1112

Packaging

Tape & Reel (TR)

Program Memory Size

16KB (16K x 8)

EEPROM Size

-

Program Memory Type

FLASH

Part Status

Active

Operating Temperature

-40°C ~ 85°C (TA)

Peripherals

Brown-out Detect/Reset, POR, WDT

Supplier Device Package

28-TSSOP

Connectivity

I²C, SPI, UART/USART

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Mounting Type

Surface Mount

Number of I/O

22

Core Processor

ARM® Cortex®-M0

Speed

50MHz

Package / Case

28-TSSOP (0.173", 4.40mm Width)

Series

LPC1100L

Data Converters

A/D 6x10b

RAM Size

4K x 8

Oscillator Type

Internal