NXP USA Inc. MKL03Z8VFG4R

Product Details

Peripherals

LVD, POR, PWM, WDT

Voltage - Supply (Vcc/Vdd)

2.7V ~ 5.5V

Connectivity

LINbus, SPI, UART/USART

Mounting Type

Surface Mount

Number of I/O

18

Core Processor

S08

Speed

20MHz

Package / Case

20-SOIC (0.295", 7.50mm Width)

Series

S08

Data Converters

A/D 8x12b

RAM Size

512 x 8

Oscillator Type

Internal

Core Size

8-Bit

Program Memory Size

4KB (4K x 8)

Packaging

Tape & Reel (TR)

Program Memory Type

FLASH

EEPROM Size

128 x 8

Operating Temperature

-40°C ~ 105°C (TA)

Part Status

Not For New Designs

Supplier Device Package

20-SOIC