NXP USA Inc. MC9S12XET256CAG

Product Details

Part Status

Active

Operating Temperature

-40°C ~ 85°C (TA)

Peripherals

Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT

Supplier Device Package

176+25UFBGA (10x10)

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, SPI, UART/USART, USB OTG

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Mounting Type

Surface Mount

Number of I/O

140

Core Processor

ARM® Cortex®-M4

Speed

180MHz

Package / Case

201-UFBGA

Series

STM32F4

Data Converters

A/D 24x12b; D/A 2x12b

RAM Size

256K x 8

Oscillator Type

Internal

Core Size

32-Bit

Base Part Number

STM32F427

Packaging

Tape & Reel (TR)

Program Memory Size

2MB (2M x 8)

EEPROM Size

-

Program Memory Type

FLASH