NXP USA Inc. MC9S08SE8CWLR

Product Details

Packaging

Tape & Reel (TR)

Program Memory Type

FLASH

EEPROM Size

-

Operating Temperature

-40°C ~ 105°C (TA)

Part Status

Active

Supplier Device Package

32-QFN (5x5)

Peripherals

Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT

Voltage - Supply (Vcc/Vdd)

1.71V ~ 3.6V

Connectivity

I²C, SPI, UART/USART

Mounting Type

Surface Mount

Number of I/O

28

Core Processor

ARM® Cortex®-M0+

Speed

48MHz

Package / Case

32-VFQFN Exposed Pad

Series

Kinetis KL0

Data Converters

A/D 14x12b; D/A 1x12b

RAM Size

4K x 8

Oscillator Type

Internal

Core Size

32-Bit

Program Memory Size

32KB (32K x 8)