NXP USA Inc. MC9S08AW16CPUE

Product Details

Mounting Type

Surface Mount

Number of I/O

36

Core Processor

ARM® Cortex®-M0

Speed

48MHz

Package / Case

56-UFQFN Exposed Pad

Series

PSOC® 4 CY8C4xx8 BLE

Data Converters

A/D 16x12b SAR; D/A 2xIDAC

RAM Size

32K x 8

Oscillator Type

Internal

Core Size

32-Bit

Program Memory Size

256KB (256K x 8)

Packaging

Tray

Program Memory Type

FLASH

EEPROM Size

-

Operating Temperature

-40°C ~ 85°C (TA)

Part Status

Active

Supplier Device Package

56-QFN (7x7)

Peripherals

Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT

Voltage - Supply (Vcc/Vdd)

1.71V ~ 5.5V

Connectivity

I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART