NXP USA Inc. MC56F8256VLF

Product Details

Part Status

Active

Operating Temperature

-40°C ~ 85°C (TA)

Peripherals

Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT

Supplier Device Package

100-TFBGA (9x9)

Connectivity

CANbus, I²C, IrDA, LINbus, MMC, SPI, SSC, UART/USART, USB

Voltage - Supply (Vcc/Vdd)

1.62V ~ 3.6V

Mounting Type

Surface Mount

Number of I/O

63

Core Processor

ARM® Cortex®-M3

Speed

84MHz

Package / Case

100-TFBGA

Series

SAM3A

Data Converters

A/D 16x12b; D/A 2x12b

RAM Size

96K x 8

Oscillator Type

Internal

Core Size

32-Bit

Base Part Number

ATSAM3A

Packaging

Tray

Program Memory Size

512KB (512K x 8)

EEPROM Size

-

Program Memory Type

FLASH