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NXP USA Inc. MC33PF8200DGES

IC POWER MANAGEMENT I.MX8QM

Manufacturer
NXP USA Inc.
Datasheet
Price
0
Stock
0

Product Details

Operating Temperature
-40°C ~ 125°C
Supplier Device Package
48-LQFP-EP (7x7)
Series
-
Packaging
Tape & Reel (TR)
Part Status
Obsolete
Applications
System Basis Chip
Mounting Type
Surface Mount
Package / Case
48-LQFP Exposed Pad
Current - Supply
7mA
Voltage - Supply
3.5V ~ 28V