NXP USA Inc. LPC1112FHN33/203,5

Product Details

Connectivity

I²C, IrDA, LINbus, SmartCard, SPI, UART/USART

Mounting Type

Surface Mount

Number of I/O

20

Core Processor

ARM® Cortex®-M3

Speed

40MHz

Package / Case

32-VFQFN Exposed Pad

Series

Jade Gecko

Data Converters

A/D 20x12b

RAM Size

32K x 8

Oscillator Type

Internal

Core Size

32-Bit

Program Memory Size

256KB (256K x 8)

Packaging

Tray

Program Memory Type

FLASH

EEPROM Size

-

Operating Temperature

-40°C ~ 85°C (TA)

Part Status

Active

Supplier Device Package

32-QFN (5x5)

Peripherals

Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT

Voltage - Supply (Vcc/Vdd)

1.85V ~ 3.8V