NXP USA Inc. LPC1112FDH28/102:5

Product Details

Core Processor

ARM® Cortex®-M0+

Speed

48MHz

Package / Case

24-VFQFN Exposed Pad

Series

Kinetis KL03

Data Converters

A/D 7x12b

RAM Size

2K x 8

Oscillator Type

Internal

Core Size

32-Bit

Program Memory Size

32KB (32K x 8)

Packaging

Tape & Reel (TR)

Program Memory Type

FLASH

EEPROM Size

-

Operating Temperature

-40°C ~ 105°C (TA)

Part Status

Active

Supplier Device Package

24-QFN (4x4)

Peripherals

Brown-out Detect/Reset, LVD, POR, PWM, WDT

Voltage - Supply (Vcc/Vdd)

1.71V ~ 3.6V

Connectivity

I²C, SPI, UART/USART

Mounting Type

Surface Mount

Number of I/O

22