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GigaDevice Semiconductor (HK) Limited GD25LQ256DYIGR
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- Manufacturer
- GigaDevice Semiconductor (HK) Limited
- Datasheet
- Price
- 0
- Stock
- 731
Product Details
- Packaging
- Digi-Reel®
- Supplier Device Package
- 44-TSOP II
- Technology
- SRAM - Asynchronous
- Write Cycle Time - Word, Page
- 45ns
- Access Time
- 45ns
- Memory Size
- 4Mb (256K x 16)
- Memory Type
- Volatile
- Part Status
- Active
- Memory Format
- SRAM
- Mounting Type
- Surface Mount
- Package / Case
- 44-TSOP (0.400", 10.16mm Width)
- Memory Interface
- Parallel
- Voltage - Supply
- 2.2V ~ 3.6V
- Series
- MoBL®
- Operating Temperature
- -40°C ~ 85°C (TA)