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Epson Electronics America Inc-Semiconductor Div S1C17W22D101100

IC MCU 16BIT 64KB FLASH DIE

Manufacturer
Epson Electronics America Inc-Semiconductor Div
Datasheet
Price
2.1
Stock
0

Product Details

Core Size
8-Bit
Base Part Number
PIC16C55A
Packaging
Tape & Reel (TR)
Program Memory Size
768B (512 x 12)
EEPROM Size
-
Program Memory Type
OTP
Part Status
Active
Operating Temperature
0°C ~ 70°C (TA)
Peripherals
POR, WDT
Supplier Device Package
28-SSOP
Connectivity
-
Voltage - Supply (Vcc/Vdd)
3V ~ 5.5V
Mounting Type
Surface Mount
Number of I/O
20
Core Processor
PIC
Speed
4MHz
Package / Case
28-SSOP (0.209", 5.30mm Width)
Series
PIC® 16C
Data Converters
-
RAM Size
25 x 8
Oscillator Type
External