Epson Electronics America Inc-Semiconductor Div S1C17W15D001000

Product Details

Peripherals

LVD, POR, PWM, WDT

Voltage - Supply (Vcc/Vdd)

2.4V ~ 5.5V

Connectivity

LINbus-UART

Mounting Type

Surface Mount

Number of I/O

17

Core Processor

F²MC-8FX

Speed

16MHz

Package / Case

20-SOIC (0.295", 7.50mm Width)

Series

F²MC-8FX MB95560H

Data Converters

A/D 6x8/10b

RAM Size

496 x 8

Oscillator Type

External

Core Size

8-Bit

Program Memory Size

20KB (20K x 8)

Packaging

Tube

Program Memory Type

FLASH

EEPROM Size

-

Operating Temperature

-40°C ~ 85°C (TA)

Part Status

Active

Supplier Device Package

20-SOIC