Epson Electronics America Inc-Semiconductor Div S1C17W03F101100

Product Details

Series

dsPIC™ 33EV

Data Converters

A/D 13x10b/12b

RAM Size

4K x 8

Oscillator Type

Internal

Core Size

16-Bit

Base Part Number

DSPIC33EV32GM1

Packaging

Digi-Reel®

Program Memory Size

32KB (11K x 24)

EEPROM Size

-

Program Memory Type

FLASH

Part Status

Active

Operating Temperature

-40°C ~ 85°C (TA)

Peripherals

Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT

Supplier Device Package

36-UQFN (5x5)

Connectivity

CANbus, I²C, IrDA, LINbus, SPI, UART/USART

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Mounting Type

Surface Mount

Number of I/O

25

Core Processor

dsPIC

Speed

70 MIPs

Package / Case

36-UFQFN Exposed Pad