Epson Electronics America Inc-Semiconductor Div S1C17M12F101100-250

Product Details

Connectivity

I²C, SPI, UART/USART

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Mounting Type

Through Hole

Number of I/O

17

Core Processor

PIC

Speed

32MHz

Package / Case

20-DIP (0.300", 7.62mm)

Series

PIC® XLP™ 16F

Data Converters

A/D 17x10b

RAM Size

512 x 8

Oscillator Type

Internal

Core Size

8-Bit

Base Part Number

PIC16LF1559

Packaging

Tube

Program Memory Size

14KB (8K x 14)

EEPROM Size

-

Program Memory Type

FLASH

Part Status

Active

Operating Temperature

-40°C ~ 125°C (TA)

Peripherals

Brown-out Detect/Reset, POR, PWM, WDT

Supplier Device Package

20-PDIP