Epson Electronics America Inc-Semiconductor Div S1C17F57D402000

Product Details

Part Status

Active

Operating Temperature

-40°C ~ 85°C (TA)

Peripherals

DMA, LVD, POR, PWM, WDT

Supplier Device Package

40-HWQFN (6x6)

Connectivity

CSI, I²C, LINbus, UART/USART

Voltage - Supply (Vcc/Vdd)

1.6V ~ 5.5V

Mounting Type

Surface Mount

Number of I/O

28

Core Processor

RL78

Speed

32MHz

Package / Case

40-WFQFN Exposed Pad

Series

RL78/G13

Data Converters

A/D 9x8/10b

RAM Size

16K x 8

Oscillator Type

Internal

Core Size

16-Bit

Base Part Number

R5F101

Packaging

Tray

Program Memory Size

192KB (192K x 8)

EEPROM Size

-

Program Memory Type

FLASH