Epson Electronics America Inc-Semiconductor Div S1C17704F401100

Product Details

Part Status

Active

Supplier Device Package

32-HVQFN (5x5)

Peripherals

LVD, POR, PWM, WDT

Voltage - Supply (Vcc/Vdd)

2.4V ~ 5.5V

Connectivity

CSI, I²C, LINbus, UART/USART

Mounting Type

Surface Mount

Number of I/O

10

Core Processor

RL78

Speed

32MHz

Package / Case

32-VFQFN Exposed Pad

Series

RL78/I1E

Data Converters

A/D 8x10b, 3x24b; D/A 1x12b

RAM Size

8K x 8

Oscillator Type

Internal

Core Size

16-Bit

Program Memory Size

32KB (32K x 8)

Packaging

Tray

Program Memory Type

FLASH

EEPROM Size

4K x 8

Operating Temperature

-40°C ~ 105°C (TA)