Epson Electronics America Inc-Semiconductor Div S1C17704B402100

Product Details

Series

RX200

Data Converters

A/D 8x12b

RAM Size

64K x 8

Oscillator Type

Internal

Core Size

32-Bit

Program Memory Size

384KB (384K x 8)

Packaging

Tray

Program Memory Type

FLASH

EEPROM Size

8K x 8

Operating Temperature

-40°C ~ 85°C (TA)

Part Status

Active

Supplier Device Package

48-LFQFP (7x7)

Peripherals

DMA, LVD, POR, PWM, WDT

Voltage - Supply (Vcc/Vdd)

1.8V ~ 5.5V

Connectivity

CANbus, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG

Mounting Type

Surface Mount

Number of I/O

30

Core Processor

RXv2

Speed

54MHz

Package / Case

48-LQFP