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Cypress Semiconductor Corp MB86613SPMC-G-BNDE1

IC MCU ASSP CE61 100LQFP

Manufacturer
Cypress Semiconductor Corp
Datasheet
Price
0
Stock
0

Product Details

Part Status
Obsolete
Supplier Device Package
120-LQFP (16x16)
Peripherals
I²S, LCD, LVD, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd)
1.65V ~ 3.6V
Connectivity
CSIO, I²C, LINbus, SmartCard, UART/USART, USB
Mounting Type
Surface Mount
Number of I/O
102
Core Processor
ARM® Cortex®-M0+
Speed
40MHz
Package / Case
120-LQFP
Series
FM0+ S6E1B8
Data Converters
A/D 24x12b
RAM Size
32K x 8
Oscillator Type
Internal
Core Size
32-Bit
Program Memory Size
304KB (304K x 8)
Packaging
Tray
Program Memory Type
FLASH
EEPROM Size
-
Operating Temperature
-40°C ~ 105°C (TA)