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Chip Quik, Inc. SMDLTLFP500T4C
SOLDER PASTE LOW TEMP T4 500G
- Manufacturer
- Chip Quik, Inc.
- Datasheet
- Price
- 157.5
- Stock
- 0
Product Details
- Flux Type
- -
- Shelf Life
- 9 Months
- Wire Gauge
- -
- Composition
- Ag40Cu30Zn28Ni2 (40/30/28/2)
- Part Status
- Active
- Melting Point
- 1220 ~ 1435°F (660 ~ 780°C)
- Shelf Life Start
- Date of Manufacture
- Form
- Jar, 1 oz (28g)
- Storage/Refrigeration Temperature
- 41°F ~ 77°F (5°C ~ 25°C)
- Type
- Solder Paste
- Series
- -
- Process
- Lead Free
- Diameter
- -