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Chip Quik, Inc. PA0225-S

LSOP-10 STENCIL

Manufacturer
Chip Quik, Inc.
Datasheet
Price
11.59
Stock
0

Product Details

Thickness
0.0040" (0.102mm)
Part Status
Active
Inner Dimension
0.094" L x 0.083" W (2.40mm x 2.10mm)
Outer Dimension
1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad
-
Number of Positions
14
Type
BGA
Pitch
0.020" (0.50mm)
Series
Proto-Advantage PA
Material
Stainless Steel