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Chip Quik, Inc. PA0194-S

TSSOP-20-EXP-PAD STENCIL

Manufacturer
Chip Quik, Inc.
Datasheet
Price
11.59
Stock
0

Product Details

Outer Dimension
1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad
0.130" L x 0.067" W (3.30mm x 1.70mm)
Number of Positions
12
Type
DFN
Pitch
0.020" (0.50mm)
Series
Proto-Advantage IPC
Material
Stainless Steel
Thickness
0.0040" (0.102mm)
Part Status
Active
Inner Dimension
0.157" L x 0.118" W (4.00mm x 3.00mm)