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Chip Quik, Inc. PA0009-S
SOIC-24 STENCIL
- Manufacturer
- Chip Quik, Inc.
- Datasheet
- Price
- 11.59
- Stock
- 0
Product Details
- Thermal Center Pad
- 0.254" L x 0.254" W (6.45mm x 6.45mm)
- Number of Positions
- 44
- Type
- QFN/LFCSP
- Pitch
- 0.026" (0.65mm)
- Series
- Proto-Advantage IPC
- Material
- Stainless Steel
- Thickness
- 0.0040" (0.102mm)
- Part Status
- Active
- Inner Dimension
- 0.315" L x 0.315" W (8.00mm x 8.00mm)
- Outer Dimension
- 1.300" L x 0.900" W (33.02mm x 22.86mm)