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Chip Quik, Inc. PA0001-S

SOIC-8 STENCIL

Manufacturer
Chip Quik, Inc.
Datasheet
Price
11.59
Stock
2

Product Details

Part Status
Active
Inner Dimension
0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension
1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad
0.161" L x 0.161" W (4.10mm x 4.10mm)
Number of Positions
40
Type
QFN/LFCSP
Pitch
0.020" (0.50mm)
Series
Proto-Advantage IPC
Material
Stainless Steel
Thickness
0.0040" (0.102mm)