Images are for reference only. See Product Specifications for product details
Chip Quik, Inc. IPC0192-S
QFN-36/LFCSP-36 (5 CENTER PADS)
- Manufacturer
- Chip Quik, Inc.
- Datasheet
- Price
- 12.93
- Stock
- 0
Product Details
- Outer Dimension
- 1.300" L x 0.900" W (33.02mm x 22.86mm)
- Thermal Center Pad
- -
- Number of Positions
- 25
- Type
- BGA
- Pitch
- 0.016" (0.40mm)
- Series
- Proto-Advantage BGA
- Material
- Stainless Steel
- Thickness
- 0.0040" (0.102mm)
- Part Status
- Active
- Inner Dimension
- -