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Chip Quik, Inc. FPC030P045-S

FPC/FFC SMT CONN STENCIL

Manufacturer
Chip Quik, Inc.
Datasheet
Price
11.59
Stock
0

Product Details

Outer Dimension
1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad
-
Number of Positions
8
Type
Mini SOIC
Pitch
0.026" (0.65mm)
Series
Proto-Advantage PA
Material
Stainless Steel
Thickness
0.0040" (0.102mm)
Part Status
Active
Inner Dimension
0.118" L x 0.118" W (3.00mm x 3.00mm)