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Aries Electronics 32-6570-10

CONN IC DIP SOCKET ZIF 32POS TIN

Manufacturer
Aries Electronics
Datasheet
Price
16.24
Stock
0

Product Details

Termination
Solder
Contact Material - Mating
Beryllium Copper
Pitch - Post
0.100" (2.54mm)
Material Flammability Rating
UL94 V-0
Mounting Type
Through Hole
Contact Finish Thickness - Post
200.0µin (5.08µm)
Pitch - Mating
0.100" (2.54mm)
Contact Finish Thickness - Mating
200.0µin (5.08µm)
Contact Resistance
-
Number of Positions or Pins (Grid)
32 (2 x 16)
Dielectric Material
Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish - Post
Tin
Type
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Current Rating (Amps)
1A
Series
57
Operating Temperature
-
Features
Closed Frame
Contact Finish - Mating
Tin
Packaging
Bulk
Contact Material - Post
Beryllium Copper
Part Status
Active
Termination Post Length
0.110" (2.78mm)