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Aries Electronics 08-6823-90C

CONN IC DIP SOCKET 8POS GOLD

Manufacturer
Aries Electronics
Datasheet
Price
5.33
Stock
0

Product Details

Features
Open Frame
Contact Finish - Mating
Gold
Packaging
Bulk
Contact Material - Post
Beryllium Copper
Part Status
Active
Termination Post Length
0.126" (3.20mm)
Termination
Solder
Contact Material - Mating
Beryllium Copper
Pitch - Post
0.100" (2.54mm)
Material Flammability Rating
UL94 V-0
Mounting Type
Through Hole
Contact Finish Thickness - Post
10.0µin (0.25µm)
Pitch - Mating
0.100" (2.54mm)
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Resistance
20mOhm
Number of Positions or Pins (Grid)
40 (2 x 20)
Dielectric Material
Polybutylene Terephthalate (PBT), Glass Filled
Contact Finish - Post
Gold
Type
DIP, 0.6" (15.24mm) Row Spacing
Current Rating (Amps)
1A
Series
XR2
Operating Temperature
-55°C ~ 125°C